5336 is a black, electrically isolating, self-leveling, highly thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes or as a two-part, room temperature kit.
Pot Life @ 25°C | 1.5 hours |
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Viscosity, Part A, @ 25°C | 70,000 cPs |
Viscosity, Part B, @ 25°C | 25 cPs |
Viscosity, Mixed, @ 25°C | 21,000 cPs |
Shelf Life | 12 months @ -60°C 6 months @ -40°C 12 months @ 25°C |
Mix Ratio A:B | 100:6 Parts By Weight |
2 hours @ 80°C 4 hours @ 60°C 24 hours @ 25°C
Based on cure of 2 hours @ 80°C
Color | Black |
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Shore D Hardness | 93 |
Glass Transition Temp (°C) | 63 |
Density (g/cc) | 2.5 |
Lap Shear (psi) | 2,040 |
Based on cure of 2 hours @ 80°C
Dielectric Constant | 5.99 @ 100 kHz |
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Dissipation Factor | 0.14 @ 100 kHz |
Dielectric Strength (volts/mil) | 478 |
Volume Resistivity (ohm-cm) | 3.5E+15 @ 500 VDC |
Based on cure of 2 hours @ 80°C
CTE below Tg | 24.6 ppm/°C |
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CTE above Tg | 90.3 ppm/°C |
Glass Transition Temp (°C) | 63 |
Operating Temp. Range (°C) | -40 to 150 |
Degradation Temp. (°C) | 300 |
Thermal Conductivity (W/mK) | 1.48 |
Based on cure of 2 hours @ 80°C
TML (%) | 0.31 |
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CVCM (%) | 0.01 |
WVR (%) | 0.04 |
Velocity (m/s) | 3207 |
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Impedance (MRayls) | 8.07 |
Loss (dB/cm-MHz) | -7.42 |
Density (g/cc) | 2.5 |
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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