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5302 Epoxy
1.85 W/mK
Appli-Tec 5302 epoxy was designed specifically for potting circuit board connectors. With its 4-hour pot life, the material is ideal for automated dispensing and features controlled flow – making it easy to deposit. 5302 meets NASA’s outgassing requirements and has a wide range of curing options. The material bonds well with most substrates.
This product will exotherm if cured at high temperatures in masses greater than 5 grams. Contact Appli-Tec for step cure instructions if curing in larger masses.
Uncured
| Pot Life @ 25°C | 4 hours |
|---|---|
| Viscosity @ 25°C | 125,000 cPs |
| Shelf Life @ -40°C | 12 Months |
| Color | Blue |
| Thixotropic Index | 1.9 |
Cure options
1 hour @ 120°C 5 minutes @ 150°C
Cured Properties
Based on cure of 1 hour @ 120°C
| Color | Dark Tan |
|---|---|
| Shore D Hardness | 97 |
| Glass Transition Temp. (°C) | 134 |
| Density (g/cc) | 2.62 |
| Lap Shear 2024T3 Clad (psi) | 2,500 |
Electrical Properties
| Volume Resistivity (ohm-cm) | 2.13E 16 @500 VDC |
|---|
Thermal Properties
Based on cure of 1 hour @ 120°C
| Glass Transition Temp. (°C) | 134 |
|---|---|
| Thermal Conductivity (W/mK) | 1.85 |
| Degradation Temp. (°C) | 275 |
Outgassing Properties
Based on cure of 1 hour @ 120°C
| TML (%) | 0.07 |
|---|---|
| CVCM (%) | <0.01 |
| WVR (%) | 0.04 |
Acoustic Properties
| Velocity (m/s) | 3,450 |
|---|---|
| Impedance (MRayls) | 9.03 |
| Loss (dB/cm-MHz) | -8.3 |
| Density (g/cc) | 2.62 |
Key Features
- High Thermal Conductivity
- Resistant to Fuel, Lubricants, Water, and Weather
- Bonds Well to Most Substrates
- Can Be Used for Potting & Encapsulation
- Changes Color When Cured
- Snap Cure at 150 °C
- High Glass Transition Temperature
- High Temperature Resistant
- Long Pot Life
- Meets NASA Outgassing Requirements
- User-friendly Packaging
- √ RoHS Compliant
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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