5230 Epoxy

Electrically Conductive, Long Pot Life, and Room Temperature Cure

5230 is a silver filled epoxy combining long pot life and room temperature cure. 5230 features a bio-based curing agent. The material is ideal for bonding applications and can be used as a cold solder for delicate, heat sensitive components. 5230 has a volume resistivity of 0.001 ohm-cm and a thermal conductivity of 1.75W/mK. The epoxy is available in bulk kits and premixed and frozen syringes, and meets NASA’s low outgassing requirements.

Uncured

Pot Life90 minutes
Viscosity Part A @ 25°CPaste
Viscosity Part B @ 25°C90 cPs
Shelf Life @ -40°C6 months
Shelf Life @ -60°C10 months
Shelf Life @ -75°C24 months
Shelf Life @ 25°C6 months (Appli-Pac®, Bulk Kit)
Mix Ratio100A:8.6B Parts By Weight

Cure options

2 hours @ 80°C 24 hours @ 25°C 30 minutes @ 100°C

Cured Properties

Based on cure of 2 hours @ 80°C

ColorSilver
Shore D Hardness85
Glass Transition Temp (°C)85
Specific Gravity3.0
Lap Shear 2024T3 Clad (psi)1,165

Electrical Properties

Based on cure of 2 hours @ 80°C

Volume Resistivity (ohm-cm)1.0E-3

Thermal Properties

Based on cure of 2 hours @ 80°C

Glass Transition Temp (°C)85
Operating Temp. Range (°C)-60 to 120
Thermal Conductivity (W/mK)1.75
Degradation Temp. (°C)300

Outgassing Properties

Based on cure of 2 hours @ 80°C

TML (%)0.34
CVCM (%)<0.01
WVR (%)0.07

Key Features

  • High Electrical Conductivity
  • NASA Low Outgassing
  • Low Shrinkage
  • Room Temperature Cure
  • Long Pot Life
  • Bonds to a variety of substrates
  • Cold Solder
  • Thermally Conductive

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev B
8/2/2024

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