5230 is a silver filled epoxy combining long pot life and room temperature cure. 5230 features a bio-based curing agent. The material is ideal for bonding applications and can be used as a cold solder for delicate, heat sensitive components. 5230 has a volume resistivity of 0.001 ohm-cm and a thermal conductivity of 1.75W/mK. The epoxy is available in bulk kits and premixed and frozen syringes, and meets NASA’s low outgassing requirements.
Pot Life | 90 minutes |
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Viscosity Part A @ 25°C | Paste |
Viscosity Part B @ 25°C | 90 cPs |
Shelf Life @ -40°C | 6 months |
Shelf Life @ -60°C | 10 months |
Shelf Life @ -75°C | 24 months |
Shelf Life @ 25°C | 6 months (Appli-Pac®, Bulk Kit) |
Mix Ratio | 100A:8.6B Parts By Weight |
2 hours @ 80°C 24 hours @ 25°C 30 minutes @ 100°C
Based on cure of 2 hours @ 80°C
Color | Silver |
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Shore D Hardness | 85 |
Glass Transition Temp (°C) | 85 |
Specific Gravity | 3.0 |
Lap Shear 2024T3 Clad (psi) | 1,165 |
Based on cure of 2 hours @ 80°C
Volume Resistivity (ohm-cm) | 1.0E-3 |
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Based on cure of 2 hours @ 80°C
Glass Transition Temp (°C) | 85 |
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Operating Temp. Range (°C) | -60 to 120 |
Thermal Conductivity (W/mK) | 1.75 |
Degradation Temp. (°C) | 300 |
Based on cure of 2 hours @ 80°C
TML (%) | 0.34 |
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CVCM (%) | <0.01 |
WVR (%) | 0.07 |
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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