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5018 Epoxy
Excellent choice for bonding dissimilar substrates and assemblies requiring thick bond lines
5018 is an amber, electrically isolating, toughened, precision mixed, degassed, and frozen epoxy. It features excellent low temperature properties, a long work life of 6 hours, and a low viscosity making it a very user‐friendly epoxy. Once cured, this material is tough and flexible, making it an excellent choice for bonding dissimilar substrates and assemblies requiring thick bond lines. 5018 will bond well to most substrates such as metals, glass, ceramics, and most plastics. This material has a CVCM of 0.18% which exceeds the 0.10% limit for low outgassing. The TML is 0.75% which does pass low outgassing.
This product will exotherm if cured at high temperatures in masses greater than 5 grams. Contact Appli-Tec for step cure instructions if curing in larger masses.
Uncured
| Work Life @ 25°C | 6 hours |
|---|---|
| Viscosity @ 25°C | 3,500 cPs |
| Pot Life @ 25°C | 3 hours |
| Shelf Life | 12 months @ ‐40°C 24 months @ ‐60°C |
Cure Options
7 days @ 25°C 72 hours @ 45°C 6 hours @ 80°C
Cured Properties
Based on cure of 6 hours @ 80°C
| Color | Amber |
|---|---|
| Shore D Hardness | 80 |
| Glass Transition Temp (°C) | 60 |
| Density (g/cc) | 1.13 |
Electrical Properties
Based on cure of 6 hours @ 80°C
| Volume Resistivity (ohm‐cm) | 1.0E 14 @ 500 VDC |
|---|
Thermal Properties
Based on cure of 6 hours @ 80°C
| Glass Transition Temp (°C) | 60 |
|---|---|
| Degradation Temp. (°C) | >240 |
Acoustic Properties
| Velocity (m/s) | 2,421 |
|---|---|
| Impedance (MRayls) | 2.736 |
| Loss (dB/cm‐MHz) | ‐6.9 |
| Density (g/cc) | 1.13 |
Key Features
- Bonds Well to Most Substrates
- Can Be Used for Potting & Encapsulation
- Long Work Life
- Low Viscosity
- High Bond Strength
- Thermal Shock Resistant
- User‐friendly Packaging
- √ RoHS Compliant
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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