Potting and Encapsulation

Your one-source supplier for potting and encapsulation of micro-electronic assemblies.

With 35 years of experience, Appli-Tec is the go-to provider for companies requiring potting and encapsulation, using thermally conductive electrically insulating materials, for electronics, PCBs, coils, magnets, and sensors.

Our specialty is working with companies on prototyping and pilot work of assemblies for complex or niche applications – bringing them to full production.

We help our customers reduce costs and increase yields by controlling and consolidating the entire supply chain – from component sourcing and assembly to adhesive mixing and final testing in our ESD compliant production area.

All you do is supply a drawing to let us optimize your Value Stream Management.

Value Stream Management
- Turnkey services
- Consultative approach
- Supply chain consolidation
- Tested, defect-free adhesives
Capabilities
- Pilot work / Prototyping
- Complex or niche applications
- Small volume runs
- Component sourcing & assembly
- Incoming, in-process, and finished goods testing
Custom Applications
- High thermal conductivity / Electrical insulation
- Resistance to tampering or reverse engineering
- Protection from contaminants, lubricants, corrosion, weather, etc.
- Low outgassing to meet NASA requirements
- Customer-specific adhesive and process development
Reduced Risk
- 100% material traceability
- Climate controlled process rooms
- Adhesive materials tested extensively before use
- Work performed by IPC-certified workers
Certifications
- ISO9001/AS9100 certified Electro-Mechanical Assembly
- ISO9001/AS9100 certified Potting & Encapsulation
- IPC-A-610, J-STD-001, IPC-7711
- ESD-certified and tested flooring
FOD Protocols
- Tack mats
- Hair/beard nets
- Nitrile gloves
- Smocks / Coveralls