Articles by Alisha Adams

To encapsulate a small section or component of a circuit board, a process called “dam and fill” can be used.

The impact of mix ratio on adhesive performance is critical and impacts everything from cure rate to outgassing properties.

Temperature and humidity greatly affect viscosity, pot life, adhesive performance, and cured properties.

The type of adhesive cure to use depends on your application, what you’re trying to achieve, and your time frame.

95% of our product line is solvent-free – meaning the materials aren’t flammable or have very low VOC emission.

Learn why bonding components to PCBs is different than metal-to-metal bonding (e.g. aluminum to aluminum).

Appli-Tec thermally conductive adhesives eliminate the three challenges associated with thermal grease and pads for heat sink applications.

The key difference between potting and encapsulation explained.

Solve challenges with heat sink applications that thermal conductive pads can’t handle.

Testing an adhesive’s lap shear is important because it allows for a strength comparison between different adhesive materials on a known substrate.

My Adhesive Material Seems Thicker Than Normal. What’s the Problem?

The choice of which chemistry to use is based on the application requirements.