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With continued innovations, Appli-Tec can “weather” a two-week power outage — ensuring on-time delivery of PMF adhesive materials.

Appli-Tec now offers stocked parts for our most frequently ordered adhesive formulations.

To encapsulate a small section or component of a circuit board, a process called “dam and fill” can be used.

New 5340 Epoxy – Conveniently packaged in 1:1 dual cartridges for easy mixing.

Appli-Tec improved several metrics, including 80% or more of shelf-life remaining for products shipped, shorter lead times, and OTD.

Appli-Tec’s 5390 Epoxy is very thermally conductive, electrically insulative, and silver-free.

The impact of mix ratio on adhesive performance is critical and impacts everything from cure rate to outgassing properties.

Temperature and humidity greatly affect viscosity, pot life, adhesive performance, and cured properties.

CEO Tim Walsh’s thoughts on Appli-Tec’s 40th anniversary — and how the company has transformed over the last three years.

Appli-Tec has had 100% traceability for decades. If you’re ever audited, we can tell you who did what, when, where, and how.

How the Appli-Tec team reduced the amount of trash by 90%.

The type of adhesive cure to use depends on your application, what you’re trying to achieve, and your time frame.