Adhesive Tech Tips

To encapsulate a small section or component of a circuit board, a process called “dam and fill” can be used.

Temperature and humidity greatly affect viscosity, pot life, adhesive performance, and cured properties.

Appli-Tec has had 100% traceability for decades. If you’re ever audited, we can tell you who did what, when, where, and how.

The type of adhesive cure to use depends on your application, what you’re trying to achieve, and your time frame.

Learn why bonding components to PCBs is different than metal-to-metal bonding (e.g. aluminum to aluminum).

Appli-Tec thermally conductive adhesives eliminate the three challenges associated with thermal grease and pads for heat sink applications.

The key difference between potting and encapsulation explained.

Work life and pot life can vary greatly depending on the adhesive material, its packaging (e.g. frozen, two-part kit), and the application.

Surface preparation methods and processes for getting the most from your adhesive application.

Used in small quantities, minor components can have a disproportionate impact on an adhesive system’s performance.

Why thixotropy is your friend!

How a company’s product and hidden costs can soar due to mixing adhesives in-house.