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5108 Epoxy
Self-leveling, withstands high humidity environments
5108 is a black, electrically isolating epoxy adhesive specifically designed for potting and sealing electronic components. 5108 is a self-leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. This material is also environmentally friendly. 5108 is available in one-part pre-mixed and frozen syringes and two-part room temperature stable kits.
Uncured
| Pot Life @ 25°C | 2 hours |
|---|---|
| Viscosity, Part A @25°C | 2,100 cPs |
| Viscosity, Part B @25°C | 11,000 cPs |
| Viscosity, mixed @ 25°C | 5,000 cPs |
| Shelf Life, PMF | @ ‐40°C 6 Months |
| Shelf Life, 2-Part Kit | @18°C to 25°C 12 Months |
| Mix Ratio | 100A to 51.75B parts by weight |
Cure Options
1 hour @ 92°C 4 hours @ 65°C 48 hours @ 25°C
Cured Properties
Based on cure of 4 hours @ 65°C
| Color | Black |
|---|---|
| Shore D Hardness | 80 |
| Lap Shear (psi) | 3500 |
| Density (g/cc) | 1.07 |
| Glass Transition Temp (°C) | 45 |
| Shrinkage Linear (%) | 0.26 |
Electrical Properties
Based on cure of 4 hours @ 65°C
| Dielectric Constant | 3.2 @ 1 kHz |
|---|---|
| Dissipation Factor | 0.008 @ 1 kHz |
| Dielectric Strength (volts/mil) | 580 |
| Volume Resistivity (ohm‐cm) | 7.0E 13 @ 500 VDC |
Thermal Properties
Based on cure of 4 hours @ 65°C
| Glass Transition Temp (°C) | 45 |
|---|---|
| Degradation Temp. (°C) | 275 |
Outgassing Properties
Based on cure of 4 hours @ 65°C
| TML (%) | 0.75 |
|---|---|
| CVCM (%) | 0.01 |
| WVR (%) | 0.39 |
Acoustic Properties
| Velocity (m/s) | 2,345 |
|---|---|
| Impedance (MRayls) | 2.51 |
| Loss (dB/cm‐MHz) | ‐4.83 |
| Density (g/cc) | 1.07 |
Key Features
- Adheres to Dissimilar Materials
- Ideal for Bonding, Potting & Encapsulation
- Self Leveling
- Hydrolytic Stability
- High Temperature Resistant
- Low Shrinkage
- √ RoHS Compliant
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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