Appli-Thane® 7308

1.11 W/mK

The perfect choice for automated dispensing, Appli-Thane® 7308 maintains its dispensability for over 8 hours. The material can be cured during mass-reflow without disturbing the placement of components, thus eliminating several costly “component level” processing steps. It also eliminates the need for a separate cure cycle. The material meets NASA’s outgassing requirements and cures to a semi-flexible material with low modulus and a very low Tg. This material is thixotropic and maintains its form until subjected to temperatures exceeding 120°C.

Uncured

Work Life @ 25°C8 hours
Viscosity @ 25°CPaste
Shelf Life @ -40°C12 Months

Cure Options

4 hrs @ 71°C 2 hrs @ 100°C 60 sec @ 200°C

Cured Properties

Based on cure of 4 hours @ 71°C

ColorRed
Shore A Hardness86
Glass Transition Temp (C)-34
Density (g/cc)2.3
Lap Shear 2024T3 Clad (psi)300
Tensile Strength (psi)400
Peel Strength (lb/in.)4
Cleavage Strength (lb/in width)165
Tensile Modulus (psi)1,200
Compressive Modulus (psi)3,250
Elongation (%)40

Electrical Properties

Based on cure of 4 hours @ 71°C

Dielectric Constant7.3 @ 10 kHz 6.3 @ 100 kHz 5.07 @ 1 MHz
Dissipation Factor0.121 @ 10 kHz 0.07 @ 100 kHz 0.042 @ 1 MHz
Dielectric Strength (volts/mil)650
Volume Resistivity (ohm-cm)1.0E 14@500 VDC

Thermal Properties

Based on cure of 4 hours @ 71°C

CTE below Tg (ppm/°C)50
CTE above Tg (ppm/°C)120
Glass Transition Temp (°C)-34
Operating Temp. Range (°C)-100 to 125
Thermal Conductivity (W/mK)1.11

Outgassing Properties

Based on cure of 4 hours @ 71°C

TML (%)0.21
CVCM (%)0.01
WVR (%)0.1

Acoustic Properties

Velocity (m/s)1,771
Impedance (MRayls)4.062
Loss (dB/cm-MHz)-14.85
Density (g/cc)2.30

Key Features

  • High Thermal Conductivity
  • Mass-reflow Curable
  • Electrically Insulative
  • Semi-flexible
  • Superior Thermal Cycling
  • Hydrolytic Stability
  • Ideal for Electrical Potting
  • Very Long Pot Life
  • Perfect for Automated Dispensing
  • Low Glass Transition Temperature
  • Low Modulus
  • Meets NASA Outgassing Requirements
  • Thixotropic
  • Solvent Resistant
  • Re-workable at Ambient Temperature
  • √ RoHS Compliant

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Rev F
12/19/2024

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