The perfect choice for automated dispensing, Appli-Thane® 7308 maintains its dispensability for over 8 hours. The material can be cured during mass-reflow without disturbing the placement of components, thus eliminating several costly “component level” processing steps. It also eliminates the need for a separate cure cycle. The material meets NASA’s outgassing requirements and cures to a semi-flexible material with low modulus and a very low Tg. This material is thixotropic and maintains its form until subjected to temperatures exceeding 120°C.
Work Life @ 25°C | 8 hours |
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Viscosity @ 25°C | Paste |
Shelf Life @ -40°C | 12 Months |
4 hrs @ 71°C 2 hrs @ 100°C 60 sec @ 200°C
Based on cure of 4 hours @ 71°C
Color | Red |
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Shore A Hardness | 86 |
Glass Transition Temp (C) | -34 |
Density (g/cc) | 2.3 |
Lap Shear 2024T3 Clad (psi) | 300 |
Tensile Strength (psi) | 400 |
Peel Strength (lb/in.) | 4 |
Cleavage Strength (lb/in width) | 165 |
Tensile Modulus (psi) | 1,200 |
Compressive Modulus (psi) | 3,250 |
Elongation (%) | 40 |
Based on cure of 4 hours @ 71°C
Dielectric Constant | 7.3 @ 10 kHz 6.3 @ 100 kHz 5.07 @ 1 MHz |
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Dissipation Factor | 0.121 @ 10 kHz 0.07 @ 100 kHz 0.042 @ 1 MHz |
Dielectric Strength (volts/mil) | 650 |
Volume Resistivity (ohm-cm) | 1.0E 14@500 VDC |
Based on cure of 4 hours @ 71°C
CTE below Tg (ppm/°C) | 50 |
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CTE above Tg (ppm/°C) | 120 |
Glass Transition Temp (°C) | -34 |
Operating Temp. Range (°C) | -100 to 125 |
Thermal Conductivity (W/mK) | 1.11 |
Based on cure of 4 hours @ 71°C
TML (%) | 0.21 |
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CVCM (%) | 0.01 |
WVR (%) | 0.1 |
Velocity (m/s) | 1,771 |
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Impedance (MRayls) | 4.062 |
Loss (dB/cm-MHz) | -14.85 |
Density (g/cc) | 2.30 |
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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